• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    method of bonding a thermoplastic polymer to a thermosetting polymer component. The invention relates to a method of attaching a thermoplastic polymer to a thermoset polymer component, the thermoplastic polymer having a melting temperature that exceeds the cure temperature of the thermoset polymer. the method comprises the steps of providing a cured thermoset polymer component comprising an implant of a thermoplastic polymer at least in the part of the thermoset polymer component to be bonded, placing a thermoplastic polymer in contact with at least the part to be bonded, heating the assembly to the melting temperature of the thermoplastic polymer, whereby the thermoplastic polymer of the implant melts and fuses with the thermoplastic polymer and cools the assembly. the thermoplastic polymer has a melting temperature that exceeds the cure temperature of the thermoset polymer, and the implant is designed so that heating above the maximum operating temperature of the thermoset polymer at the interface of the implant with the thermoset polymer component is avoided during binding step.
    公开号:BR112013030154B1
    申请号:R112013030154-6
    申请日:2012-05-25
    公开日:2021-07-27
    发明作者:Michael Johannes Leonardus Van Tooren
    申请人:Fokker Aerostructures B.V.；
    IPC主号:
    专利说明:

    Field of Invention
    [001] The present invention relates to a method for attaching a thermoplastic polymer to a component of a thermoset polymer. The invention also relates to a method of linking a thermoset polymer component to another thermoset polymer component. The invention further relates to a cured thermoset polymer component comprising an implant of a thermoplastic polymer at least in the part of the thermoset polymer component to be bonded and to an uncured or partially cured thermoset polymer component having a implant of a thermoplastic polymer that forms a bondable surface. The invention further relates to an assembly of a cured thermoset polymer component with a thermoplastic surface and a thermoplastic polymer component welded thereto. Background of the Invention
    [002] Thermoplastic polymers (fiber-reinforced), including oligomers, are increasingly used as building materials because they offer the possibility of recycling. A thermoplastic polymer can be heated to soften it (amorphous thermoplastics) or to finally melt (semicrystalline thermoplastics) and then cooled to return to its solid state. Such temperature-induced physical changes are generally reversible, which makes thermoplastic polymers recyclable. In solid amorphous thermoplastics, the polymeric molecular chains are arranged randomly, while in solid semicrystalline thermoplastics, some parts of them comprise polymeric molecular chains arranged in an orderly fashion: the crystalline regions. The invention is not limited to one type of thermoplastic polymer, even if the text “casting” or “casting” is used. Thermoplastic polymers have a glass transition temperature (Tg) above which, with additional heating, progressive softening occurs. At temperatures substantially higher than the glass transition temperature, amorphous thermoplastics behave like a high-viscosity liquid, while semi-crystalline polymers still remain solid in this temperature range. Semicrystalline thermoplastics have a melting temperature (Tm), above which the material melts and behaves like a liquid. With additional increases in temperature, the viscosity rapidly decreases.
    [003] Thermoset polymers are typically crosslinked polymers comprising resins such as epoxide (often called epoxy), bismaleimide, unsaturated polyester and vinyl ester polymers. A thermoset polymer typically comprises, prior to curing, a resin (a monomer) and a hardener, which react together to produce a crosslinked polymer. Curing can be designed to take place at room temperature or at higher temperatures, which typically range between 80 and 200 °C. During curing, the monomer and hardener react and the viscosity of the mixture increases until it becomes a cross-linked solid polymer, whose state is not reversible by a change in temperature, unless the thermoset polymer is degraded at a temperature above its degradation temperature. After curing, a thermoset polymer also exhibits a glass transition temperature, above which considerable softening of the thermoset polymer occurs and the thermoset polymer behaves like a rubber.
    [004] Composite polymer materials comprise a fiber or particulate reinforcement embedded in a matrix polymer, which may be thermoset or thermoplastic. Well known polymer compounds include fiberglass reinforced polyester resin, and carbon fiber reinforced epoxy. Both of these compounds use thermoset polymers as a matrix and therefore are often called thermoset compounds.
    [005] A major disadvantage of thermoset polymers (compounds) is that they are generally not weldable, since a thermoset polymer cannot be melted and resolidified by raising and lowering the temperature. Thermoset polymers (compounds) are typically adhered to other components by adhesive bonding or bolting, both of which have disadvantages. Adhesive bonding is expensive, sometimes dangerous for the environment, and the quality of bonding obtained is generally sensitive to variations in process parameters. Bolting, on the other hand, forms holes in the components to be bonded, which gives rise to stress concentrations and possibly premature failure.
    [006] WO 2007/109855 A1 discloses a method for adhering a thermoplastic molded part to a molded part of a thermosetting polymer, which is provided with an insert of a thermoplastic polymer. Adhesion is accomplished by contacting the thermoplastic molded part with the portion to be bonded and heating the assembly to the melting temperature of the thermoplastic molded part, where the thermoplastic polymer of the insert melts and fuses with the thermoplastic molded part. Heating is carried out by high frequency welding.
    [007] An article by Pratt et al: "Method of ultrasonically welding RIM parts using thermoplastic inserts", Motorola Technical Developments, vol. 27, May 1, 1996, pages 200-201, also describes a method for joining a thermoplastic molded part to a molded part of a thermosetting RIM nylon polymer providing a thermoplastic insert into the RIM nylon part and applying ultrasonic welding.
    [008] US2002/0113066 A1 discloses yet another method for adhering a thermoplastic molded part to a molded part of a thermosetting polymer. The thermoset molded part is obtained by curing it with a layer of thermoplastic material to which ferromagnetic particles have been added. In this way, a bondable surface is created to bond to the thermoplastic molded part by means of ultrasonic welding.
    [009] PCT/AU2007/001296 (WO2008/028224) describes a method for connecting a thermoplastic connector, for example, to a thermoset composite tube, the composite tube being provided with a thermoplastic insert. Bonding is achieved by heating and recooling the thermoplastics.
    [0010] It would be desirable to provide a broader range of thermoset polymers or thermoset polymer compounds with the possibility of joining them by soldering to another thermoset polymer or thermoset polymer composite, or to a thermoplastic polymer (compound).
    [0011] US2010/0173161 describes a method for joining functional components with at least thermoplastic components to thermosetting composites with at least some thermoplastic surface. The thermosetting composite has a functional thermoplastic surface layer fixed by a compatible thermoplastic selection process, heating the blended materials to allow migration of the uncured thermoset polymer to the thermoplastic polymer, and then cooling the blended materials to provide a surface thermoplastic tightly fixed. The thermosetting composite component may have a coating of polymeric material.
    [0012] US2009/0246548 discloses a process for bonding a semicrystalline or crystalline thermoplastic polymer to a thermosetting polymer component, the process including the selection of compatible semicrystalline thermoplastic polymer and uncured thermoset polymer components, wherein the curing temperature of the components of thermosetting polymer is above the melting temperature of the semicrystalline thermoplastic polymer.
    [0013] The present invention provides a method for attaching a thermoset polymer component (compound) to another thermoset polymer component by providing the thermoset polymer (compound) with a thermoplastic implant, which provides a thermally bondable surface.
    [0014] The invention further provides a cured thermoset polymer component comprising an implant of a thermoplastic polymer, at least in the part of the thermoset polymer component to be bonded, as well as an uncured or partially cured thermoset polymer component with an implant of a thermoplastic polymer that forms a bondable surface.
    [0015] The invention also provides an assembly of a cured thermoset polymer component with a thermoplastic surface and a thermoplastic polymer.
    [0016] The present invention further provides an uncured or partially cured thermoset polymer component having a thermoplastic polymer implant (component) that forms a thermally bondable surface and an assembly of a cured thermoset polymer component having a thermoplastic surface and a thermoplastic polymer component welded to it. Invention Summary
    [0017] In a first aspect, the invention provides a method for connecting a thermoplastic polymer (component) to a thermoset polymer component, the thermoplastic polymer having a melting temperature that exceeds the cure temperature of the thermoset polymer, the method comprising the steps of a) providing a thermoplastic polymer, b) providing an uncured or partially cured thermoset polymer component with a curing temperature below the melt temperature of the thermoplastic polymer and comprising an implant of a thermoplastic polymer at least in part of the thermoset polymer component to be bonded, c) locate the thermoplastic polymer in contact with at least the part to be bonded, d) heat the thermoplastic polymer and a thermoset polymer component to the melting temperature of the thermoplastic polymer, whereby the thermoplastic polymer of the implant melts and fuses with the thermoplastic polymer, and whereby the thermoplastic polymer component uncured fixed and the thermoplastic polymer of the implant interpenetrate at least partially; and e) cooling the thermoplastic polymer assembly and the cured thermoset polymer component so that the thermoplastic polymer is bonded to the cured thermoset polymer component, wherein the thermoplastic polymer has a melting temperature that exceeds the cure temperature of the thermoset polymer, and the implant is designed so that heating above the maximum operating temperature of the thermoset polymer at the interface of the implant with the thermoset polymer component is avoided during bonding step d).
    [0018] The maximum operating temperature of a polymer (compound) is well known to the person skilled in the art and is typically provided by the supplier.
    [0019] In the method according to the invention, the thermoplastic polymer implant acts as a heat sink for the thermoset polymer component (compound), whereby the heat applied to melt the thermoplastic polymer to be bonded and the polymer The implant's thermoplastic is located substantially at the interface to be welded, while this heat is absorbed by the fusion of the implant's thermoplastic polymer. According to the invention, a temperature gradient is maintained in the thermoplastic implant during thermal bonding by soldering, so that the temperature at the interface of the implant with the thermoset polymer component (compound) is low enough not to substantially degrade the thermoset polymer , even when heating is above such degradation temperature. This prevents excessive heating at the interface between the thermoset polymer (compound) and the implant, and thus offers the possibility of bonding a thermoplastic polymer to a thermoset polymer component, which thermoplastic polymer has a melting temperature that exceeds the cure temperature of thermoset polymer, by welding.
    [0020] The advantage described above is in particular useful for aerospace and aircraft applications, where the relatively high temperatures of use dictate the use of thermoplastic polymers with a relatively high melting temperature.
    [0021] In an embodiment of the invention, a method is provided in which the heat capacity of the implant per unit length in J/°K/m is greater than the heat applied to the assembly per unit length during step d). In other words, the placement and transverse dimensions of the implant, as well as the thermoplastic polymer of the implant, are selected so that the above requirements are fulfilled. The heat applied to the assembly per unit length during step d), in particular the welding heat per unit length, is also material-specific and depends on a number of factors, such as the welding method used, the heat capacity material to be welded, its conductivity and the time required to sustain the molten state in order to obtain a well-consolidated material after heating or spot welding. The welding heat per unit length can easily be determined experimentally by a person skilled in the art.
    [0022] In another embodiment of the invention, a method is provided in which heat sinks are applied to parts of the implant, more preferably externally to the implant, and more preferably to the outer edges of the implant. Suitable heat sinks include blocks, strips, bars and the like of a material typically used as a heat sink material, in particular having a relatively high specific heat capacity. Suitable materials include metals. The interface of the heat sinks with the implant can also be provided, for example, with a heat-absorbing paste. Heat sinks are removed after switching on.
    [0023] The implants of the thermoset polymer component preferably comprise reinforcing fibers. In yet another embodiment of the invention, a method is provided wherein the implant comprises reinforcing fibers that extend into the thermoset polymer. This modality allows to reduce the heat and/or time of soldering, thus avoiding the degradation of the thermoplastic and/or thermoset polymer during bonding, still obtaining a satisfactory bond strength.
    [0024] In another aspect of the invention, a method is provided for connecting a thermoset polymer component to another thermoset polymer component, in which method the thermoplastic polymer is provided in the form of a cured thermoset polymer component comprising an implant of the thermoplastic polymer.
    [0025] In yet another aspect of the invention, a cured thermoset polymer component is provided which comprises an implant of a thermoplastic polymer at least in the part of the thermoset polymer component to be bonded.
    [0026] In a preferred embodiment of the first aspect of the invention, a method is provided in which the implant is designed such that excessive heat at the interface of the implant with the thermoset polymer component is avoided.
    [0027] In another preferred embodiment of the invention, a method is provided in which the thermoset polymer component comprises a fiber reinforced thermoset polymer composite component.
    [0028] Yet another preferred embodiment of the method according to the invention is characterized in that the thermoset polymer component is a set of pre-impregnated, stacked thermoset polymer composite tapes and an implant comprising thermoplastic polymer composite tapes prepregs stacked.
    [0029] Another embodiment of the method according to the invention relates to a method wherein the thermoplastic polymer to be bonded is a thermoplastic polymer component or a component with a compatible thermoplastic polymer surface.
    [0030] Another preferred embodiment of the method according to the invention makes use of a thermoplastic polymer to be bonded and/or a thermoplastic polymer of the implant that is selected from the class of engineering thermoplastic polymers with a melting temperature of at least 200 ° Ç. In an even more preferred method, the thermoplastic polymer to be bonded and/or the thermoplastic polymer of the implant is selected from polyetherimide (PEI), polyetheretherketone (PEEK), polyphenylene sulfide (PPS), polyetherketone (PEK), polyetherketone (PEKK) and combinations or equivalents thereof.
    [0031] Another modality of the method according to the invention is characterized by the fact that the thermoplastic polymer to be bonded or the thermoplastic polymer of the implant comprises electrically conductive particles for localized heating.
    [0032] In an embodiment of the method according to the invention, the thermoset polymer comprises a mixture of epoxy resin/hardener and/or bismaleimide.
    [0033] The uncured or partially cured thermoset polymer component with an implant of a thermoplastic polymer that forms a bondable surface can be conveniently made by stacking pre-impregnated thermoset polymer composite tapes and by stacking polymer composite tapes pre-impregnated thermoplastic that form the implant. Thermoplastic implants can also be made IN SITU using injection techniques. Co-injection of thermoset polymers and thermoplastics is also possible.
    [0034] The thermoset polymer component comprising the implant is preferably bonded to a thermoplastic polymer (component) or another thermoset polymer component, comprising the implant by welding to another thermoset polymer or thermoset polymer compound o^ to a thermoplastic polymer ( compound).
    [0035] Preferred welding techniques include, but are not limited to, induction welding, resistance welding and laser welding.
    [0036] In another aspect of the invention, there is provided an assembly of a cured thermosetting polymer with a thermoplastic surface and thermoplastic polymer component welded thereto, the thermoplastic polymer having a melting temperature that exceeds the curing temperature of the thermosetting polymer.
    [0037] In any of the above embodiments of the invention, the thermoplastic polymer implant and the uncured thermoset polymer or thermoset polymer composite adjacent to the implant are able, when heated, to at least partially interpenetrate before the thermoset polymer cures, of that way by connecting the thermoplastic polymer implant to the thermosetting polymer or thermosetting polymer composite. This ensures that the thermoplastic surface provided to the thermoset polymer (compound) by the implant is not easily removed from the thermoset polymer or thermoset polymer composite.
    [0038] A cured or uncured thermoset polymer or thermoset polymer composite with a thermoplastic implant can be bonded to another thermoplastic polymer according to the invented method, or it can be bonded to a second thermoset polymer or thermoset polymer composite provided with a thermoplastic implant.
    [0039] Another advantage of the inventive method is that the molten thermoplastic polymer to be bonded and the thermoplastic polymer of the implant provide high flow of thermoplastic polymer when placed in contact with each other, thus filling any undulations or imperfections in the contact surfaces to be bonded . Thermoplastic flow can be influenced by changing the temperature and/or applying more contact pressure to the components to be bonded during heating or allowing more time for bonding.
    [0040] An advantage of the method of the invention further relates to the fact that the components that were previously connected to each other can be dismantled and reassembled again when this is desired, simply reheating the welded thermoplastic and the thermoplastic implant at least partially. If desired, additional thermoplastic polymer can be added between the surfaces to be bonded for better bonding. Reheating can also be useful to improve the quality of the produced weld, if desired in selected areas.
    [0041] In general, the method according to the invention will be carried out at a temperature above the glass transition temperature of the cured thermoset polymer or polymer composite component, at least at the interface between the thermoplastic polymer implant and the thermoset polymer. However, binding can involve a temperature that is only slightly higher than this temperature, or that can even be close to the degradation temperature of the thermoset polymer.
    [0042] The thermoset polymer component (compound) may comprise other components, such as metal inserts, foam or honeycomb core, thermoplastic or thermoset components or films bonded thereto by methods other than according to the invention, or any other material that can be incorporated as an integral part of a thermoset (composite) component. Brief Description of Figures
    [0043] The invention will now be described in more detail by way of example, without, however, being limited thereto and with reference to the associated figures, in which:
    [0044] Figure 1 illustrates a first embodiment of a cured thermoset polymer component with a thermoplastic surface and a thermoplastic polymer component to be welded thereto, in accordance with the invention;
    [0045] Figure 2 represents a second embodiment of a cured thermoset polymer component with a thermoplastic surface and a thermoplastic polymer component to be welded thereto, in accordance with the invention;
    [0046] Figure 3 represents another embodiment of a cured thermoset polymer component with a thermoplastic surface and a thermoplastic polymer component to be welded thereto, in accordance with the invention; and
    [0047] Figure 4 schematically illustrates an embodiment of a thermoplastic implant to be used in the method of the invention. Description of Preferred Modalities
    [0048] With reference to Figure 1, an embodiment of an assembly 1 of a cured thermoset polymer component 2 with a thermoplastic surface 3 is shown, to which a thermoplastic polymer component 4 can be welded according to the method of the invention. The thermoplastic polymer of thermoplastic polymer component 4 has a melting temperature of between 250°C and 400°C, which exceeds the cure temperature of the thermoset polymer used in thermoset polymer component 2, whose curing temperature typically ranges between approximately at room temperature and 200°C. Set 1 was obtained by a method comprising providing a cured or partially cured thermoset polymer (the precursor of the cured component 2) with an implant 5 of a thermoplastic polymer at least in the part of the thermoset polymer component to be bonded, which is the surface 3 in the present case, and cure the thermoset polymer, whereby the uncured thermoset polymer component 2 and the thermoplastic polymer of the implant 5 interpenetrate at least in part.
    [0049] This process forms a bond between the thermoplastic polymer implant 5 and the cured thermoset polymer 2. Due to the high curing temperature, the thermoset monomers can actually migrate more easily through the thermoplastic polymer implant 5, in particular its crystalline domains. In this way, a strong bond is formed between the two. Obviously, the cure temperature and temperature cycle are preferably selected so that the thermoset monomers (and the hardener) are able to migrate sufficiently deep into the molten polymer of implant 5. Supplying thermoset polymer 2 with thermoplastic implant 5 can be carried out without changing the manufacturer's recommended cure cycle for thermoset polymer 2. However, a small change may be necessary, in particular when the compatibility between thermoset polymer 2 and the thermoplastic polymer of implant 5 is not ideal.
    [0050] According to the invention, the thermoplastic polymer (component) 4 is placed in contact with at least the surface 3 of the set 1 and the thermoplastic polymer and the thermoset polymer component are heated to the melting temperature of the thermoplastic polymer 4 , whereby the thermoplastic polymer of the implant 5 melts and fuses with the thermoplastic polymer (component) 4, in other words, a bond is formed between the thermoplastic polymer implant 5 and the thermoplastic polymer (component) 4, which bond is consolidated after cooling the thermoplastic polymer assembly 1 5 and the cured thermoset polymer component 2.
    [0051] To avoid excessive heating of the thermoset polymer during the bonding process, the welding zone must be selected according to the geometry of the thermoplastic implant 5. In Figure 1, a weldable area is schematically shown as area 6. heating in this area 6 can be done at the melting temperature of one or both thermoplastic polymers 4 and 5. These polymers 4 and 5 preferably have a melting temperature which is different only by 20°C, more preferably 15°C and most preferably only 10 °C. Preferably, thermoplastic polymers 4 and 5 are substantially the same polymer. The thermoplastic polymer of implant 5 is bonded to an inner surface (as in the Example shown in Figure 1) or to an outer surface (as in the Example shown in Figure 2) of thermoset polymer 2 during curing of thermoset polymer 2, preferably by formation of a semi-interpenetrating polymer network. To this end, thermoplastic polymer 5 is preferably compatible with the thermoset monomers chosen from thermoset polymer 2. The person skilled in the art of polymer science has sufficient tools at his disposal, such as well-known thermodynamic and solubility criteria.
    The typical bond strength achievable using the method according to the invention exceeds 30 MPa, more preferably 35 MPa and most preferably exceeds 40 MPa (double bend bond strength test).
    [0053] Typical weld pressures range from 50 KPa to 1 MPa, with a range of 100 KPa to 350 KPa being preferred. However, the method according to the invention can also provide good bonds when no pressure is applied, however pressures greater than 1 MPa can also be used, although such pressures may imply some compressive removal of the molten thermoplastic.
    [0054] Another embodiment of an assembly 1 of a cured thermoset polymer component 2 with a thermoplastic surface 3 is shown, to which a thermoplastic polymer component 4 can be welded according to the method of the invention shown in Figure 2. In this case , the thermoplastic polymer implant 5 is effectively bonded to an outer surface of the thermoset polymer component 2. However, its function is still in accordance with the invention, since the implant 5 is dimensioned so that by limiting the area weldable to area 6, excessive heating of the thermoset polymer at the interface with implant 5 is avoided.
    [0055] The thermoset polymer 2, provided with a thermoplastic polymer implant 5, can be joined to a thermoplastic component 4 under the supply of external heat and pressure, such as, for example, by a heated plate. Alternatively, a local heating element or even heatable materials incorporated within the components to be connected can be used, allowing the heat to be centralized in the welding area 6.
    [0056] Since in the method according to the invention the heating occurs above the melting temperature of thermoplastic polymers 4 and 5, these thermoplastics will show substantial flux during welding, even under relatively low welding pressures. This flux allows thermoplastics 4 and 5 to fill small irregularities in their surfaces or even gaps in relatively small spaces between components 2 and 4 to be welded.
    [0057] Yet another embodiment of an assembly 1 of a cured thermoset polymer component 2 with a thermoplastic surface 3, to which a thermoplastic polymer component 4 can be welded according to the method of the invention, is shown in Figure 3. In this case, the thermoplastic polymer implant 5 is provided with two heat sinks 10 and 11, provided on its outer edges. The implant 5 is dimensioned and so that, by limiting the weldable area to area 6, the heating of the thermoset polymer 2 at the interface 7 with the implant 5 is limited so that the maximum operating temperature of the thermoset polymer is not exceeded. Heat sinks 10 and 11 absorb some of the welding heat. Heat sinks 10 and 11 are provided to implant 5 using layers of a heat absorbing paste 8. Thermoset polymer 2, provided with thermoplastic polymer implant 5, is joined to thermoplastic component 4 by use of a welding torch 9 which is placed in contact with the welded part 4 within the contact area 6.
    [0058] Figure 4 illustrates, finally, a schematic side view of a preferred implant to be used in the method of the invention. In the embodiment shown, an implant of a thermoplastic polymer is provided comprising continuous reinforcing fibers 12 that extend beyond the boundaries (50, 51) of the implant 5. By consolidating such an implant with a thermoset polymer component, the free (dry) parts of the fibers 12 will extend into the thermoset polymer, where these fiber parts will be moistened with thermoset polymer and will be integrated with the thermoset polymer component after curing. It has been disclosed that an implant according to this embodiment is particularly useful in the method of the invention, as it allows the formation of satisfactory bonding forces, yet limiting the heat applied during bonding.
    [0059] The method according to the invention further allows to remove and separate the previously welded components 2 and 4. The components (2, 4) are furthermore heated to a temperature above the melting temperature of the thermoplastic polymers (4, 5) and both components (2, 4) are separated at least in part, which requires limited strength. As each component (2, 4) substantially retains most of its surface properties, the separate components can be re-welded according to the method of the invention. If desired, additional thermoplastic material can be added between the thermoplastic surfaces to be bonded, in case insufficient thermoplastic material is available for good bonding.
    [0060] A bonded assembly 1 according to the invention can additionally provide advantages such as better chemical resistance, better wear and erosion resistance, better biocompatibility, better friction properties and the like.
    [0061] It will be understood that the invention, as disclosed in the detailed description, is provided by way of example only, and that many variations may be envisaged by the person skilled in the art within the scope of the appended claims.
    权利要求:
    Claims (12)
    [0001]
    1. Method for attaching a thermoplastic polymer (4) to a thermoset polymer component (2), the method being CHARACTERIZED in that it comprises the steps of: a) providing a thermoplastic polymer (4), b) providing a polymer component cured thermoset (2) comprising an implant (5) of a thermoplastic implant polymer with at least the portion of the thermoset polymer component (2) to be bonded, c) placing the thermoplastic polymer (4) in contact with at least the part to be bonded, d) heating the thermoplastic polymer (4) and the thermoset polymer component (2) at least in the contact area to the melting temperature of the thermoplastic polymer (4), whereby the thermoplastic implant polymer (5) melts and fuses with the thermoplastic polymer (4); and e) cooling the thermoplastic polymer (4) assembly (1) and the cured thermoset polymer component (2) so that the thermoplastic polymer (4) is bonded to the cured thermoset polymer component (2), wherein the thermoplastic polymer (4,5) has a melting temperature that exceeds the cure temperature of the thermoset polymer (2), where the heat applied to melt the thermoplastic polymer (4) to be bonded and the thermoplastic implant polymer (5) is located. if substantially at the interface to be welded, and wherein the implant (5) is designed so that heating above the maximum operating temperature of the thermoset polymer (2) at the interface (7) of the implant (5) with the thermoset polymer component (2) is avoided during the bonding step d) maintaining a temperature gradient in the thermoplastic implant (5) during the thermal bonding by welding, so that the temperature at the interface (7) of the implant (5) with the polymer component thermoset (2) is low enough not to degrade substantially giving the thermoset polymer (2), even when the heating is above such degradation temperature, and applying heat sinks (10,11) to the implant parts, where the heat sinks (10,11) are applied directly in the implant (5), and which are removed after bonding.
    [0002]
    2. Method according to claim 1, CHARACTERIZED by the fact that the heat sinks (10,11) are applied externally to the implant (5).
    [0003]
    3. Method according to claim 1, CHARACTERIZED by the fact that the heat sinks (10,11) are applied on the outer edges of the implant (5).
    [0004]
    4. Method according to claim 1, CHARACTERIZED by the fact that the implant (5) comprises reinforcing fibers (12) that extend into the thermoset polymer (2).
    [0005]
    5. Method according to claim 1, CHARACTERIZED by the fact that the thermoplastic polymer is provided in the form of a cured thermoset polymer component (2) comprising an implant (5) of the thermoplastic polymer (4).
    [0006]
    6. Method according to claim 1, CHARACTERIZED by the fact that the cured thermoset polymer component (2) comprising the thermoplastic implant (5) is obtained by providing an uncured or partially cured thermoset polymer component (2) which has a curing temperature below the melting temperature of the thermoplastic polymer (4), and heating the thermoplastic polymer (4) and the thermosetting polymer component (2) to the curing temperature of the thermosetting polymer (2), whereby the uncured or partially cured thermoset polymer component (2) and the thermoplastic polymer of the implant (5) at least partially interpenetrate.
    [0007]
    7. Method according to claim 1, CHARACTERIZED by the fact that the thermoset polymer component (2) comprises a fiber reinforced thermoset polymer composite component (5).
    [0008]
    8. Method according to claim 1, CHARACTERIZED by the fact that the thermoplastic polymer (4) to be bonded is a thermoplastic polymer component (4) or a component with a compatible thermoplastic polymer surface.
    [0009]
    9. Method according to claim 1, CHARACTERIZED by the fact that the thermoplastic polymer (4) to be bonded and/or the thermoplastic polymer of the implant (5) is selected from the class of engineering thermoplastic polymers with a melting temperature of at least 200°C.
    [0010]
    10. Method according to claim 9, CHARACTERIZED by the fact that the thermoplastic polymer (4) to be bonded and/or the thermoplastic polymer of the implant (5) is selected from polyetherimide (PEI), polyetheretherketone (PEEK), sulfide of polyphenylene (PPS), polyetherketone (PEK), polyetherketone (PEKK) and combinations or equivalents thereof.
    [0011]
    11. Method according to claim 1, CHARACTERIZED by the fact that the thermoplastic polymer (4) to be bonded or the thermoplastic polymer of the implant (5) comprises electrically conductive particles for localized heating.
    [0012]
    12. Method according to claim 1, CHARACTERIZED by the fact that the thermoset polymer (2) comprises a mixture of epoxy and/or bismaleimide resin/hardener.
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    法律状态:
    2018-04-03| B06F| Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]|
    2019-11-05| B06U| Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]|
    2020-10-06| B06A| Patent application procedure suspended [chapter 6.1 patent gazette]|
    2021-05-11| B09A| Decision: intention to grant [chapter 9.1 patent gazette]|
    2021-07-27| B16A| Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]|Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 25/05/2012, OBSERVADAS AS CONDICOES LEGAIS. |
    优先权:
    申请号 | 申请日 | 专利标题
    NL2006848A|NL2006848C2|2011-05-25|2011-05-25|Method for bonding a thermoplastic polymer to a thermosetting polymer component.|
    NL2006848|2011-05-25|
    PCT/NL2012/000035|WO2012161569A1|2011-05-25|2012-05-25|Method for bonding a thermoplastic polymer to a thermosetting polymer component|
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